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¿ëµµ¿¡ µû¶ó NEXIV

¸ðµ¨  VMR-H3030/ H3030 Z120

        VMR-  3020/   3020 Z120

        VMR-  6555/   6555 Z120

        VMR-10080/  10080 Z120

 

NIKONÀÇ 3Â÷¿ø °¡°ø¼º/Ç¥¸é ÃøÁ¤ °Ë»ç±â

                   Model Nexiv

15:1( ¶Ç´Â 10:1)ÀÇ Á¤±³ÇÑ Zoom±¤Çаè¿Í °í¼ÓÀÇ Auto-focusingÀåÄ¡°¡ ±âº»À¸·Î ÀåÂøµÈ, ºñÁ¢ÃË½Ä ÃøÁ¤Àåºñ·Î ´ë¸éÀûÀÇ »ùÇÃ, ´Ù¼ö, ´Ù·®, ´ÙÁ¡ÀÇ½ÃÆí¿¡ ´ëÇÏ¿© ½Å¼Ó-Á¤È®ÇÑ ÃøÁ¤ÀÌ °¡´ÉÇÕ´Ï´Ù.

 

Àû¿ë: 1.  PCB PatternÀÇ ÃøÁ¤ °Ë»ç

         2. ¹ÝµµÃ¼ ÆÐŰÁö

         3. ¸ðÀçÀÇ Printing Mask

         4. Master instrument in a laboratory
         5. Dies and molds
         6. Á¤¹Ð°¡°ø ±â°è ºÎ¼Óǰ

         7. Semiconductor packages
         8. Connectors
         9. Stampled Parts

       10.  Injection molded parts

       11. Shadow masks
       12.  FPD devices    ---> 2Â÷¿ø/3Â÷¿ø À̹ÌÁö ºÐ¼®

 

¼öÁ÷/ ¼öÆò ÃøÁ¤ Á¤È®µµ(Acccuracy)--- ¸ðµ¨¿¡ µû¶ó

                                                        ¾à 0.5micron~2micron

 

Applications
Semiconductor packages (multiple pieces)
Substrates
Printing masks for substrates
Stamped parts (multiple pieces)
Connectors (multiple pieces)
Injection molded parts (multiple pieces)

•650 x 550 mm stage stroke perfect for PCBs
•Automatic measurements of small parts by placing multiple pieces together on the stage
•Laser AF achieves high-accuracy measurements of bump heights
•Laser AF also enables measurements of height gaps and warping in workpieces
•Search function enables measurements of lands and holes of PCBs
•Search function also provides accurate measurements even when workpieces are not located properly on the stage
•Variety of illumination choices facilitate accurate edge detection even for vague geometries
•High-speed stage and high-speed image processing provide high throughput

Specifications

Stroke (XxYxZ)

650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.)

Minimum readout

0.1µm

Maximum workpiece weight

30kg (66.1 lb)

Measuring accuracy

 

 

U1X, U1Y

1.5 + 2.5L/1000µm (with a workpiece max. 30kg)

 

U2XY

2.5 + 2.5L/1000µm (with a workpiece max. 30kg)

Z-axis (L: Length in mm < W.D.)

1.5 + L/150µm

Camera

B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD

Working distance

50mm

Magnification vs field of view

 

 

Optical Head for Type 1

0.5 - 7.5X / 9.33 x 7 - 0.622 x 0.467 mm

 

Optical Head for Type 2

1 - 15X / 4.67 x 3.5 - 0.311 x 0.233 mm

 

Optical Head for Type 3

2 - 30X / 2.33 x 1.75 - 0.155 x 0.117 mm

Auto focus

TTL Laser AF and Vision AF

Illumination

Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring)

Power source

AC100-240V±10%, 50/60Hz

Power consumption

Max. 13A

Dimensions & weight

 

 

Main unit & table

1220 (W) x 1680 (D) 1750 (H) mm, approx. 600kg (48.0 x 66.1 x 68.9 in., 1322.8 lb.)

 

Controller

250 (D) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)

Footprint

2400 (W) x 2000 (D) mm (94.5 x 78.7 in.)

Host Computer

Main unit

IBM PC/AT (Windows®2000)

Monitor

17-in. TFT color

 

¸ðµ¨º° Áß¿ä»ç¾ç

±¸ºÐ/¸ðµ¨

VMR-3020

VMR-6555

VMH-300N

VM-1000N

ÃÖ´ëÀ̼۰Ÿ®

300*200*150

650*550*150

300*300*155

1000*800*150

ÃÖ¼ÒºÐÇØ´É

0.1§­

0.1§­

0.01§­

0.1§­

ÃøÁ¤Á¤¹Ðµµ(X-YÃà)

(2.5+L/250)

(2.5+L/250)

(0.9+-L/300)

(3.5+L/250)

ÃøÁ¤Á¤¹Ðµµ(ZÃà)

(1.5+L/150)

(1.5+L/150)

(0.8+L/150)

(3+L/50)

ÃÖ´ëÇã¿ëÁß·®

20Kg

30Kg

10Kg

40Kg

Zoom¹èÀ²

0.5-7.5¹è(15:1)

0.5-7.5¹è(15:1)

0.75-7.5(10:1)

0.75-7.5(10:1)

ÃÑÁß·®

¾à200Kg

¾à600Kg

¾à600Kg

¾à1500Kg

 

Measurement Examples

PCB

 

LCD

 

Molded part

 

Insertion pin of semiconductor package

 

Fine metal part and its 2D profile overlaid win a master shape

 

Result evaluation diagram of a metal part

                     »ó¼¼ÇÑ »ç¾ç°ú Á¤º¸¸¦ ¿øÇÏ½Ã¸é ¾Æ·¡ ¿¬¶ôó Çѹ̻ê¾÷À¸·Î ÀüÈ­ Áֽñ⠹ٶø´Ï´Ù.

                                           ¼öÁ÷ºÐÇØ´É 100nano meterÀÌÇÏÀÇ ÃÊÁ¤¹Ð 3Â÷¿ø ÃøÁ¤±â´Â ¿©±â·Î--->

 

 Çѹ̻ê¾÷ 

ÀüÈ­ :  02 - 3411- 0173    ÆÑ½º :  02 - 3411 - 0178 

sales@gohanmi.com

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