NIKON-NEXIV

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용도에 따라 NEXIV

모델 VMR-H3030/ H3030 Z120

VMR- 3020/ 3020 Z120

VMR- 6555/ 6555 Z120

VMR-10080/ 10080 Z120

NIKON의 3차원 가공성/표면 측정 검사기

Model Nexiv

15:1( 또는 10:1)의 정교한 Zoom광학계와 고속의 Auto-focusing장치가 기본으로 장착된, 비접촉식 측정장비로 대면적의 샘플, 다수, 다량, 다점의시편에 대하여 신속-정확한 측정이 가능합니다.

적용: 1. PCB Pattern의 측정 검사

2. 반도체 패키지

3. 모재의 Printing Mask

         4. Master instrument in a laboratory
         5. Dies and molds
         6. 정밀가공 기계 부속품

         7. Semiconductor packages
         8. Connectors
         9. Stampled Parts

10. Injection molded parts

11. Shadow masks
12. FPD devices ---> 2차원/3차원 이미지 분석

수직/ 수평 측정 정확도(Acccuracy)--- 모델에 따라

약 0.5micron~2micron

Applications
Semiconductor packages (multiple pieces)
Substrates
Printing masks for substrates
Stamped parts (multiple pieces)
Connectors (multiple pieces)
Injection molded parts (multiple pieces)

•650 x 550 mm stage stroke perfect for PCBs
•Automatic measurements of small parts by placing multiple pieces together on the stage
•Laser AF achieves high-accuracy measurements of bump heights
•Laser AF also enables measurements of height gaps and warping in workpieces
•Search function enables measurements of lands and holes of PCBs
•Search function also provides accurate measurements even when workpieces are not located properly on the stage
•Variety of illumination choices facilitate accurate edge detection even for vague geometries
•High-speed stage and high-speed image processing provide high throughput

Specifications

Stroke (XxYxZ)		650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.)
Minimum readout		0.1µm
Maximum workpiece weight		30kg (66.1 lb)
Measuring accuracy
	U1X, U1Y	1.5 + 2.5L/1000µm (with a workpiece max. 30kg)
	U2XY	2.5 + 2.5L/1000µm (with a workpiece max. 30kg)
Z-axis (L: Length in mm < W.D.)		1.5 + L/150µm
Camera		B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD
Working distance		50mm
Magnification vs field of view
	Optical Head for Type 1	0.5 - 7.5X / 9.33 x 7 - 0.622 x 0.467 mm
	Optical Head for Type 2	1 - 15X / 4.67 x 3.5 - 0.311 x 0.233 mm
	Optical Head for Type 3	2 - 30X / 2.33 x 1.75 - 0.155 x 0.117 mm
Auto focus		TTL Laser AF and Vision AF
Illumination		Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring)
Power source		AC100-240V±10%, 50/60Hz
Power consumption		Max. 13A
Dimensions & weight
	Main unit & table	1220 (W) x 1680 (D) 1750 (H) mm, approx. 600kg (48.0 x 66.1 x 68.9 in., 1322.8 lb.)
	Controller	250 (D) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)
Footprint		2400 (W) x 2000 (D) mm (94.5 x 78.7 in.)
Host Computer
Main unit		IBM PC/AT (Windows®2000)
Monitor		17-in. TFT color

모델별 중요사양

구분/모델	VMR-3020	VMR-6555	VMH-300N	VM-1000N
최대이송거리	300200150	650550150	300300155	1000800150
최소분해능	0.1㎛	0.1㎛	0.01㎛	0.1㎛
측정정밀도(X-Y축)	(2.5+L/250)	(2.5+L/250)	(0.9+-L/300)	(3.5+L/250)
측정정밀도(Z축)	(1.5+L/150)	(1.5+L/150)	(0.8+L/150)	(3+L/50)
최대허용중량	20Kg	30Kg	10Kg	40Kg
Zoom배율	0.5-7.5배(15:1)	0.5-7.5배(15:1)	0.75-7.5(10:1)	0.75-7.5(10:1)
총중량	약200Kg	약600Kg	약600Kg	약1500Kg

Measurement Examples

PCB

LCD

Molded part

Insertion pin of semiconductor package

Fine metal part and its 2D profile overlaid win a master shape

Result evaluation diagram of a metal part

상세한 사양과 정보를 원하시면 아래 연락처 한미산업으로 전화 주시기 바랍니다.

수직분해능 100nano meter이하의 초정밀 3차원 측정기는 여기로--->

한미산업

전화 : 02 - 3411- 0173 팩스 : 02 - 3411 - 0178

sales@gohanmi.com